XeredEx NC-559-ASM 100 g forrasztópaszta Flux Cream SMT PCB IC forrasztás Vezeték nélküli

XeredEx NC-559-ASM 100g Solder Paste Flux Cream SMT PCB IC Soldering Lead-free
100g XeredEx NC-559-ASM BGA PCB SMT IC Reballing Soldering Paste Flux Grease
NC-559-ASM Introduction:Rework help paste applied to mobile phone PCB, BGA and SMD's PGA etc.It's used in low ionic activator system, tin-run speedLow level of smoke,surface insulation resistance value is high residue after curingTherefore, the electrical properties of the cell phones and other communications products, very little interference Features:NC-559 as a leave-in help paste residue color is very light, there is a very high value of SIRRecommended for BGA, CSP and other solder ball array repair and fill the ballWhen using smoke less, no residue. Affordable. Suitable for:North and south bridge, cards, cell phone chip, video chip BGA solder, bumpingAlso can use off the tin, the effect is very idealThe residue was less bright spot, less smoke, no pungent odor, do not run the ball Package included: 1 x 100g XeredEx NC-559-ASM BGA PCB SMT IC Reballing Soldering Paste Flux Grease
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